Global Semiconductor Capital Equipment Market 2017: By Drivers & Strains, Size and Share, Technology, New Innovations, Key Players and Future Forecast to 2021

The study of “Global Semiconductor Capital Equipment Market 2017-2021” industry is very important to enhance business productivity and for the study of market forecast. Report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Dallas, United States – July 20, 2017 /MarketersMedia/ —

Companies Mentioned: Accenture, Capgemini, Fractal Analytics, TCS, Wipro, and ZS (ZS Associates),
Cognizant, Evalueserve, EXL Service (EXL), Genpact, Gramener, HPE, IBM, Infosys, Latentview (LatentView Analytics), and WNS Global.

About Semiconductor Capital Equipment, Semiconductor capital equipment is machinery used in the production of semiconductor devices. Equipment for manufacturing semiconductor devices is classified as front-end or back-end based on the processes used. Front-end includes wafer fabrication along with other functions such as lithography, deposition, etching, cleaning, and chemical and mechanical polishing to name a few. Back-end encompasses assembly, packaging, and testing of ICs. Semiconductors are the building blocks for electronics. They form the crucial core of any electronic component. Semiconductor capital spending essentially refers to the capital investments by vendors in the semiconductor domain.

Analysts forecast the Global Semiconductor Capital Equipment Market to Grow at a CAGR Of 6.36 % During The Period 2017-2021.

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Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor capital equipment market for 2017-2021. To calculate the market size, the report considers the sale of semiconductor capital equipment to end-user segments.

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Global Semiconductor Capital Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

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Key vendors
• Applied Materials
• ASML
• KLA-Tencor
• Lam Research
• Tokyo Electron

Other prominent vendors
• ASM International
• ADVANTEST
• Hitachi High-Technologies
• Kulicke & Soffa
• Nikon
• Planar
• Rudolph Technologies
• SCREEN Semiconductor Solutions (SCREEN Holdings)
• Teradyne
• TOKYO SEIMITSU
• Veeco Instruments

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Market driver
• Integration of semiconductor devices across industrial sectors

Market challenge
• High inventory levels in supply chain

Market trend
• Rapid changes in technology driving equipment orders

Key questions answered in this report
What will the market size be in 2021 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?

Table of Contents
PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
Market outline
Semiconductor industry value chain

PART 05: Market landscape
Market overview
Market size and forecast
Five forces analysis

PART 06: Market segmentation by equipment type
Global semiconductor capital equipment by type
Wafer-level manufacturing equipment
Die-level packaging and assembly equipment
Automated test equipment

PART 07: Market segmentation by end-user
Global semiconductor capital equipment by end-user
Foundries
Memory manufacturers
IDMs

PART 08: Geographical segmentation
Global semiconductor capital equipment market by geography
APAC
Americas
EMEA

PART 09: Key leading countries
Key leading countries
Taiwan
South Korea
Japan
China

PART 10: Decision framework

PART 11: Drivers and challenges
Market drivers
Market challenges

PART 12: Market trends
Rapid changes in technology driving equipment orders
Rising prominence of 3D packaging
Large-scale development of the Chinese semiconductor industry
Automation in automobiles
Development of multi-beam e-beam inspection
Proliferation of IoT technology

PART 13: Vendor landscape
Competitive scenario
Key vendors
Other prominent vendors

PART 14: Appendix
List of abbreviations

List of Tables:
List of Exhibits
Exhibit 01: Semiconductor industry value chain
Exhibit 02: Description of semiconductor industry value chain
Exhibit 03: Segmentation of global semiconductor capital equipment market
Exhibit 04: Global semiconductor capital equipment market 2016-2021 ($ billions)
Exhibit 05: Requirements for semiconductor capital equipment
Exhibit 06: Factors influencing the purchase decisions
Exhibit 07: Five forces analysis
Exhibit 08: Global semiconductor capital equipment market by type 2016-2021 (% share of revenue)
Exhibit 09: Global semiconductor capital equipment market by type 2016-2021 ($ billions)
Exhibit 10: Global semiconductor capital equipment by wafer-level manufacturing equipment market 2016-2021 ($ billions)
Exhibit 11: Global semiconductor capital equipment market by die-level packaging and assembly equipment 2016-2021 ($ billions)
Exhibit 12: Global semiconductor capital equipment market by automated test equipment 2016-2021 ($ billions)
Exhibit 13: Global semiconductor capital equipment market by end-user 2016-2021 (% share of revenue)
Exhibit 14: Global semiconductor capital equipment market by end-user 2016-2021 ($ billions)
Exhibit 15: Global semiconductor capital equipment market by foundries 2016-2021 ($ billions)

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