Global Flip Chip Technology Market 2019 By Application, Trend, Key Manufacturer, Revenue, Type, Sales and Segmentation, Detailed Analysis and Forecast 2025
Global Flip Chip Technology Market has been thoroughly analyzed in the report for an inclusive understanding. The report includes several sections that offer indicative market insights. In the report, readers will come across analysis of market dynamics.
Dallas, United States – September 30, 2019 /MarketersMedia/ —
Global Flip Chip Technology Market 2019-2025:
In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.
The APAC held a large share of the overall flip chip technology market in 2017.
The global Flip Chip Technology market was valued at xx million US$ in 2018 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
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This report focuses on Flip Chip Technology volume and value at global level, regional level and company level. From a global perspective, this report represents overall Flip Chip Technology market size by analyzing historical data and future prospect.
Regionally, Global Flip Chip Technology Market report categorizes the production, apparent consumption, export and import of Flip Chip Technology in North America, Europe, China, Japan, Southeast Asia and India.
For each manufacturer covered, this report analyzes their Flip Chip Technology manufacturing sites, capacity, production, ex-factory price, revenue and market share in global market.
The following manufacturers are covered:
Samsung
Intel
Global Foundries
UMC
ASE
Amkor
STATS ChipPAC
Powertech
STMicroelectronics
Texas Instruments
Segment by Regions
North America
Europe
China
Japan
Southeast Asia
India
Segment by Type
FC BGA
FC PGA
FC LGA
FC QFN
FC SiP
FC CSP
Segment by Application
Consumer electronics
Telecommunication
Automotive
Industrial sector
Medical devices
Smart technologies
Military & aerospace
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Table of Contents
Executive Summary
Chapter One: Industry Overview of Flip Chip Technology Market
1.1 Definition of Flip Chip Technology
1.2 Flip Chip Technology Segment by Type
1.2.1 Global Flip Chip Technology Production Growth Rate Comparison by Types (2014-2025)
1.2.2 FC BGA
1.2.3 FC PGA
1.2.4 FC LGA
1.2.5 FC QFN
1.2.6 FC SiP
1.2.7 FC CSP
1.3 Flip Chip Technology Segment by Applications
1.3.1 Global Flip Chip Technology Consumption Comparison by Applications (2014-2025)
1.3.2 Consumer electronics
1.3.3 Telecommunication
1.3.4 Automotive
1.3.5 Industrial sector
1.3.6 Medical devices
1.3.7 Smart technologies
1.3.8 Military & aerospace
1.4 Global Flip Chip Technology Overall Market
1.4.1 Global Flip Chip Technology Revenue (2014-2025)
1.4.2 Global Flip Chip Technology Production (2014-2025)
1.4.3 North America Flip Chip Technology Status and Prospect (2014-2025)
1.4.4 Europe Flip Chip Technology Status and Prospect (2014-2025)
1.4.5 China Flip Chip Technology Status and Prospect (2014-2025)
1.4.6 Japan Flip Chip Technology Status and Prospect (2014-2025)
1.4.7 Southeast Asia Flip Chip Technology Status and Prospect (2014-2025)
1.4.8 India Flip Chip Technology Status and Prospect (2014-2025)
Chapter Two: Manufacturing Cost Structure Analysis
2.1 Raw Material and Suppliers
2.2 Manufacturing Cost Structure Analysis of Flip Chip Technology
2.3 Manufacturing Process Analysis of Flip Chip Technology
2.4 Industry Chain Structure of Flip Chip Technology
Chapter Three: Development and Manufacturing Plants Analysis of Flip Chip Technology
3.1 Capacity and Commercial Production Date
3.2 Global Flip Chip Technology Manufacturing Plants Distribution
3.3 Major Manufacturers Technology Source and Market Position of Flip Chip Technology
3.4 Recent Development and Expansion Plans
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