Global Polyamide Hot Melt Adhesives market is valued at 432$ M in 2017, expected to reach 497$ M by the end of 2023

This report provides major statistics on the state of the industry and is a valuable source of guidance and direction for companies and individuals interested in the market

Pune, India – February 27, 2018 /MarketersMedia/ —

The global Polyamide Hot Melt Adhesives market is valued at 432 million USD in 2017 and is expected to reach 497 million USD by the end of 2023, growing at a CAGR of 0.81% between 2018 and 2023.

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Companies profiled in this report are Henkel, Bostik, H.B. Fuller, 3m, Jowat, Evonik, Huntsman, Schaetti, Bühnen, Sipol , Tex Year, Xinxin-Adhesive, Shanghai Tianyang, Huate Bonding Material and more.

Analysis by Product Types, with production, revenue, price, market share and growth rate of each type, can be divided into
• Granules
• Powder
• Other

Analysis by Applications, this report focuses on consumption, market share and growth rate of Polyamide Hot Melt Adhesives in each application, can be divided into
• Woodworking
• Automotive
• Electrical
• Shoes & Textile
• Other

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Table of Contents:
1 Polyamide Hot Melt Adhesives Market Overview
2 Global Polyamide Hot Melt Adhesives Market Competition by Manufacturers
3 Global Polyamide Hot Melt Adhesives Production by Regions (2013-2018)
4 Global Polyamide Hot Melt Adhesives Consumption (MT) by Regions (2013-2018)
5 Global Polyamide Hot Melt Adhesives Production, Revenue, Price Trend by Types
6 Global Polyamide Hot Melt Adhesives Market Analysis by Applications
7 Global Polyamide Hot Melt Adhesives Manufacturers Profiles/Analysis
8 Polyamide Hot Melt Adhesives Manufacturing Cost Analysis
9 Industrial Chain, Sourcing Strategy and Downstream Buyers
10 Marketing Strategy Analysis, Distributors/Traders
11 Market Effect Factors Analysis
12 Global Polyamide Hot Melt Adhesives Market Forecast (2018-2023)
13 Research Findings and Conclusion
14 Methodology and Data Source

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Source: MarketersMedia

Release ID: 306281