Global System-in-Package Market 2016 Share,Trend,Segmentation and Forecast to 2020
WiseGuyReports.Com Publish a New Market Research Report On –“Global System-in-Package Market 2016 Share,Trend,Segmentation and Forecast to 2020”.
Pune, India – November 3, 2016 /MarketersMedia/ —
The analysts forecast the global SiP market to grow at a CAGR of 10.29% during the period 2016-2020.
A SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This reduces integration complexities on the printed circuit board (PCB) as well as making the overall design simpler.
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Covered in this report
The report covers the present scenario and the growth prospects of the global SiP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of SiP systems.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
The report, Global SiP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
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Key vendors
• Amkor Technology
• ASE
• JCET
• SPIL
• UTAC
Other prominent vendors
• ChipMOS Technology
• ChipSiP Technology
• NANIUM
• Octavo Systems
• Samsung Electro-Mechanics
Market driver
• Need to control rising costs
• For a full, detailed list, view our report
Market challenge
• High inventory levels in supply chain
• For a full, detailed list, view our report
Market trend
• Growth of OSAT vendors
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
Table Of Contents – Major Key Points
PART 01: Executive summary
• Highlights
PART 02: Scope of the report
• Definition
• Source year and forecast period
• Market overview
• Segmentation
• Geographical coverage
• Vendor segmentation
• Common currency conversion rates
• Top-vendor offerings
PART 03: Market research methodology
• Research methodology
• Economic indicators
PART 04: Introduction
• Key market highlights
PART 05: Technology overview
• Back-end chip formation
• Wafer-level versus die-level packaging and assembly
• Evolution of semiconductor packaging industry
• Eco-system of semiconductor IC packaging industry
PART 06: Market landscape
• Market overview
• Comparison between SoC, SiP, and chip-on-board (CoB)
• Market size and forecast
• Five forces analysis
PART 07: Market segmentation by application
• Communications sector
• Consumer electronics sector
• Computers sector
• Automotive sector
• Medical sector
PART 08: Market segmentation by interconnect technology
• Wire bond packaging
• Flip-chip packaging
PART 09: Market segmentation by end-user
• Foundries
• IDMs
PART 10: Geographical segmentation
• APAC
• Americas
• EMEA
..……CONTINUED
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